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Cost Models

 

Discrete and Power Products Cost and Price Model - easily calculate the manufacturing cost and selling price of most high power integrated circuits and discrete devices produced with silicon, GaAs, GaN and SiC. Includes wafer fabrication, packaging and test with hundreds of pre defined company and node specific fab processes and dozens of standard package types.

 

IC Cost and Price Model - easily calculate the manufacturing cost and selling price of most low power silicon integrated circuits. Includes wafer fabrication, packaging and test with over six hundred pre defined company and node specific fab processes and dozens of standard package types. The IC Cost Model process coverage includes past and current processes as well as processes expected to be introduced within the next year. For future processes please see the Strategic Cost Model below.

 

MEMS Cost and Price Model - easily calculate the manufacturing cost and selling price of most MEMS products. Supports up to 2 IC die and 2 MEMS die per product. Includes wafer fabrication, packaging and test with pre defined company and node specific fab processes and dozens of standard package types. For MEMS processes users can select pre defined processes or define their own.

 

Strategic Cost Model - a forward looking model that projects Logic processes out to 3.5nm, DRAM and 2D NAND out to 12nm plus 3D NAND and 3D XPoint. The model covers the top 3 DRAM, Foundry,and NAND manufacturers and leading logic manufacturers by node and produces detailed process flows, equipment requirements, materials requirements and wafer cost projections. The model is fully pre populated but also customizable customizable for process, equipment and materials. The model is wafer cost only and does not include packaging or test.

 

 

Free Downloads

 

New Applications Note - Automotive Cost Modeling

 

Cost Model Selection Guide Updated 1/1/2016

 

Cost Modeling as a Decision Making Tool