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Strategic Cost Model


The Strategic Cost Model - 2017 - revision 00 release is now available with major revision to the model and new features. BUY NOW!


To request a WebEx demo please send us an email.



The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade.


Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron..


In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.


For each target company and process every 300mm fab they have is predefined so that if you juts pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.


Supported processes

The Model supports DRAM out to 12 nm, Foundry out to 3.5nm, NAND in 2D out to 15nm/16nm as well as 3D to 256 layers and 3D XPoint to 16 layers..


Supported wafer sizes

300mm and 450mm


Supported cost elements

Wafer cost only..


Who should buy this product

The IC Knowledge - Strategic Cost Model - is in use at many large IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs as the industry implements the ITRS and 450mm,.


Latest revision


Revision 2017-00

  • Processes - updated Global Foundries 22FDX and 7nm and smaller processes, updated Intel 10nm introduction date and process, updated Samsung 7nm and smaller processes, updated TSMC 7nm and smaller processes. Updated DRAM 25nm and smaller processes. Fixed an issue where Toshiba 2D NAND was missing passivation in some processes. Updated all 3D NAND Processes.
  • NGL - No change.
  • Equipment - adjusted exposure tool throughputs. Adjusted ALD tool types and costs. Materials - Updated wafer costs by year and split out memory and logic Epi wafers.
  • Model - Updated 3D NAND comments. Added gross and net die calculations to the die and yield sheet. Added foundry margins to the 'Cost Summary' sheet. Updated labor and utility rates.
  • Yield - Updated 3D NAND defect densities. Updated Intel 14nm and 10nm defect densities.
  • Facilities - Added a sheet of the toolset footprint by tool type used to calculate cleanroom and facility sizes.
  • Fabs - updated STMicro Crolles 2. Split Samsung logic fabs into phases to better reflect investments and upgrades.


System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.


Model Cost and How to Buy

A single user license allows one user on one computer and is $5,000, an enterprise license allowing an unlimited number of users at a company is $14,000. The model may be purchased on-line with a credit card here or you may email or fax us a purchase order with 30 day terms. The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.


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Purchase Decision Tools


Strategic Cost Model Marketing Presentation - revisited 1/1/2016


Cost Model Selection Guide - updated on 10/24/2016




Support Policy- updated 10/24/2016


Strategic Cost Model Training Presentation - updated 8/18/2016