Discrete and Power Products Cost and Price Model

 

The Discrete and Power Products Cost and Price Model - 2022 - revision 05 is now available with a new process, new wafer type, data updates and new features. BUY NOW!

 

To request a demo copy please send us an email.

 

Introduction

The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices, and compund semiconductors. To model low power silicon integrated circuits we recommend our IC Cost and Price Model.

 

The Discrete and Power Model is very easy to use, the user only has to make seven selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.

 

Example of product cost summary

 

 

Supported processes

The Model supports over 300 processes broken out by company, voltage and process. See the links in the gray bar at the right for the specific list of processes.

 

Supported wafer sizes

100mm, 125mm, 150mm, 200mm and 300mm.

 

Supported cost elements

Wafer cost, wafer test, packaging and final test.

 

Who should buy this product

The IC Knowledge - Discrete and Power Products Cost and Price Model is widely used by IDMs, OEMs, Fabless companies, Analysts, Materials Companies, Consultants, Electronics Companies and many others. The model is used for benchmarking, evaluating pricing, market research and many other uses. Our model customers include most of the worlds largest IDMs, OEMs, Fabless and Electronics companies.

 

Latest Revision Changes

• Overall Model - Extended the date range on the 'Cost Per Quarter Macro' sheet to 2030. Added OnSemi to the product margin lookup. Changed the "Defaults' sheet so that when a yield model other than Murphy is selected it is clear you must enter your own defect density and n value.
• Yield - NA
• Depreciation - NA
• Processes – Added 200mm - 500nm - Wolfspeed - Gen 4 SiC - MOSFET - 1200V, NMOS, BSM - Mohawk Valley - 2P/1Al process.
• Equipment - NA
• Materials - Added 200mm - SiC - Polished wafers.
• Labor - NA
• Lookups - NA
• Facilities - NA
• Packaging – NA
• Test - NA

 

System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.

 

Related Products

Assembly and Test Cost and Price Model - calculate the cost and price of most semiconductor assembly and test operations.

• IC Cost and Price Model - easily calculate the cost and price of most low power silicon integrated circuits.
• Strategic Cost and Price Model - easily project wafer cost, equipment and materials requirements for leading IC producers.