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The Strategic Cost Model is now the Strategic Cost and Price Model


The Strategic Cost and Price Model - 2022 - revision 01 is now available with updated data and new processes. BUY NOW!



The IC Knowledge - Strategic Cost and Price Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade. We have also included some specialty processes.


Specifically the model covers:

- 2D NAND - Kioxia, Micron, Samsung - (out to 1z - 14nm)

- 3D NAND - Intel (144L), Intel-Micron (32L to 96L), Kioxia (24L to 512L), Micron (128L to 512L), Samsung (24L to 1024L), SK Hynix (36L to 768L for Charge Trap and 192L to 288L for floating gate), YMTC (32L to 128L).

- 3D XPoint - Intel-Micron (1st generation), Intel (2nd and 3rd generation)

- CFET - Generic - (1.25nm and 0.9nm)

- DRAM: Micron, Samsung, SK Hynix - (out to 1δ)

- Foundry Logic - GLOBALFOUNDRIES (out to 12nm), Samsung, and TSMC ( out to 1.5nm)

- IDM Logic - Intel MPU - (out to 12A) and ST Micro FDSOI - (out to 28nm)

- Image Sensors - Generic - (150nm and 90nm)

- NOR - Micron - (45nm)

- Silicon Photonics - (90nm)


In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.


For each target company and process every 300mm fab they have is predefined so that if you just

pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.


Supported wafer sizes



Supported cost elements

300mm Wafer cost and price. No packaging or test.


Who should buy this product

The IC Knowledge - Strategic Cost and Price Model - is in use at many IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs.


Latest revision updates


  • Model - Fixed two typos on the 'CO2' sheet. Updated and add die sizes.
  • Processes - Updated and built out Samsung 3D NAND processes above 176 layers. Updated Samsung 4nm Logic process. Updated 2XX and 3XX layer 3DNAND processes for Kioxia, Micron, SK Hynix and Samsung. Fixed an error in the "3DDRAM" process flow.
  • Equipment - NA
  • Materials - NA
  • Labor - NA
  • Yield - NA
  • Facilities - NA
  • Fabs - Moved Intel Fab 68-1 and 68-2 to SK Hynix due to the acquition of Intel's NAND business by SK Hynix and updated processes. Updated Intel D1X-Mod3 cleanroom size. Updated Intel D1X, Fabs 34, 38, 52 and 62 capacities and processes. Updated TSMC Fab 18 phases 4, 5, and 6 output. Updated Kioxia Fab 7-P1 production date and Fab K2 production date.


System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.


Model Cost and How to Buy

A single user license allows one user on one computer and is $5,500, an enterprise license allowing an unlimited number of users at a company is $15,000. The model may be purchased at a discount on-line with a credit card here or you may email or fax us a purchase order with 30 day terms. The model is delivered by email within a few hours of our receiving an order.The model cost includes twelve months of updates and support per our support policy. Renewal costs at the end of twelve months are discounted off the current prices.


Related Products





Purchase Decision Tools


Cost Model Product Line Summary and Comparison - updated 1/5/2022


Strategic Cost Model Marketing Presentation - updated 03/31/2020





Support Policy - the support policy, support request form and add process request form are all available here.


Support materials such as the training video, manual and applications notes are available in the registered users training directory.