The Strategic Cost Model is now the Strategic Cost and Price Model

 

The Strategic Cost and Price Model - 2022 - revision 04 is now available with additional fabs, updated data and bug fixes. BUY NOW!

 

Introduction

The IC Knowledge - Strategic Cost and Price Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade. We have also included some specialty processes.

 

Specifically the model covers:

- 2D NAND - Kioxia, Micron, Samsung - (out to 1z - 14nm)

- 3D NAND - Intel (144L), Intel-Micron (32L to 96L), Kioxia (24L to 512L), Micron (128L to 464L), Samsung (24L to 1024L), SK Hynix (36L to 768L for Charge Trap and 192L to 288L for floating gate), YMTC (32L to 232L).

- 3D XPoint - Intel-Micron (1st generation), Intel (2nd and 3rd generation)

- Forksheet/CFET - Generic - (10A, 7A, 5A, 3A)

- DRAM: Micron out to 1ε, Samsung to 0a plus 3D 80 layers, SK Hynix - (out to 0a)

- Foundry Logic - GLOBALFOUNDRIES (out to 12nm), Samsung, and TSMC ( out to 14A)

- IDM Logic - Intel MPU - (out to 14A) and ST Micro FDSOI - (out to 28nm)

- Image Sensors - Generic - (150nm and 90nm)

- NOR - Micron - (45nm)

- Silicon Photonics - (90nm)

 

In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.

 

For each target company and process every 300mm fab they have is predefined so that if you just

pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.

 

Supported wafer sizes

300mm

 

Supported cost elements

300mm Wafer cost and price. No packaging or test.

 

Who should buy this product

The IC Knowledge - Strategic Cost and Price Model - is in use at many IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs.

 

Latest revision updates

 

• Model - Updated the Fabs list in the 'ToolCount' sheet. Added Brazil as a country option in the model. Updated foundry margins.
• Processes - Fixed a mask definition error with the 80 layer Samsung DRAM process. Updated 3D NAND dates and stack thicknesses. Fixed an error in the Samsung 236L 3D NAND process where certain steps weren't being costed properly in the 'BlockCost' sheet. Fixed errors in the Samsung 236 and 336 layers 3D processes where a clearout etch was being used instead of a channel etch. Fixed an error in the PC (Post Carbon) clean chemical assignment. Updated Micron 128, 176, 232 and 276 layers 3D NAND processes.
• Equipment - Added throughput and cost data down to 0.25nm and updated equipment costs.
• Materials - Added material usage data down to 0.25nm. Added two new materials. Updated SiGe release and oxide recess etch to expose fins materials. Updated selected material prices. Updated post STI CMP cleaning material usage. Updated 3D NAND and 3D DRAM oxide fill CMP slurry type and post CMP cleans.
• Labor - NA
• Yield - NA
• Facilities - NA
• Fabs - Added five new Micron fabs in the US, 1 in Idaho and 4 in New York. Adjusted dates for Kioxia Fab 7.

 

System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.

 

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