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The Strategic Cost Model is now the Strategic Cost and Price Model


The Strategic Cost and Price Model - 2020 - revision 00 is now available with the most extensive update we have ever done. BUY NOW!


To request a WebEx demo please send us an email.



The IC Knowledge - Strategic Cost and Price Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade.


Specifically the model covers:

- 2D NAND - Kioxia, Micron, Samsung

- 3D NAND - Intel, Intel-Micron, Kioxia, Micron, Samsung, SK Hynix

- 3D XPoint - Intel-Micron

- DRAM: Micron, Samsung, SK Hynix

- Foundry - GLOBALFOUNDRIES, Samsung, TSMC

- IDM Logic - Intel MPU and ST Micro


In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.


For each target company and process every 300mm fab they have is predefined so that if you just

pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.


Supported processes

The Model supports 2D NAND to 14nm, 3D NAND to 512 layers, 3D XPoint to 6 layers, DRAM out 1c, Foundry to 1.75nm, IDM out to 3nm (1.75nm foundry equivalent)


Supported wafer sizes



Supported cost elements

Wafer cost and price. No packaging or test.


Who should buy this product

The IC Knowledge - Strategic Cost and Price Model - is in use at many IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs.


Latest revision updates


  • Model - Added a source column to the 'CostSum' sheet to explain where the result comes from. Expanded product sheets to allow two wafers to be defined for each process. Added a gross margin versus volume graph to the 'CostSum' sheet. Removed 200mm and 450mm wafer size options throughout the model and hard coded 300mm only. Updated foundry gross margins. Added a die size lookup sheet. Added wafer price to 'CostPerQtr' sheet.
  • Processes - Updated gate type labeling for Samsung 28nm processes. Made EUV dose editable on the product sheets. Added GF 14HP process. Updated wet clean equipment usage to reflect more single wafer processing. Created Spacer_Inner process block and added to horizontal nanosheet processes. Created titanium silicide by ALD process and added to horizontal nanosheet processes. Updated CFET process blocks. Added missing silicide step to selected logic processes. Added SiGe pFET channel to TSMC 5nm process. Created separate SiNx wet etch for 3D NAND and implemented in slot blocks. Updated SKH DRAM roadmap, added 2z and updated 1y, 1z, 1a, 1b and 1c. Reviewed and updated all wet clean usage and types and tool. Reduced DRAM storage node plate dry etch throughputs. Updated all 3D NAND process flows, added company specific products out to 512 layers and beyond and updated materials usage and throughputs. Updated logic roadmap and extended the roadmap out to 1.75nm CFET for Intel, Samsung and TSMC plus updated pitches for 5nm and below. Fixed errors in BEOL NGL blocks that had the wrong hard mask strip. Fixed a bug in the Cost Summary by Process Step section of the 'StepCost' sheet and added a process step summary column.
  • NGL - Expanded the NGL selections for DRAM to allow finer tuning of NGL use. Updated TSMC 22nm process.
  • Equipment - Added columns describing the market leader and primary tool for each tool type to the 'EquipConfig' sheet. Renamed Brightfield Inspection equipment to Broad Band Plasma and Dark Field Inspection equipment to Laser Scattering. Built out equipment calculations to support up to 12 upgrades versus 10 previously. Updated wet process tool types. Split Dry Etch - 3D into HAR and StairStep. Updated PVD tool types. Changed the OEE override options on the 'EquipCount' sheet to be in 0.5% increments instead of 1% increments. Added the ability to designate a fab as being built with reallocated equipment from other fabs reducing the equipment cost.
  • Materials - Added MoCl5 as a material. Rebuilt the materials calculations to be driven by material name, in the past materials were defined by tool type and then material type so the same material could be in the 'MatrlsSum' more than once. Updated material prices. Updated the Helium usage calculation. Added cost per year to the consumables on the 'CostDetail' sheet.
  • Labor - NA
  • Yield - Added yield defaults for all of the new processes.
  • Facilities - fixed a bug in the facilities upgrades cost calculation. Fabs - Built out the model to support up to 12 upgrades per fab versus 10 previously.


System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 or higher installed on their computer. There are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.


Model Cost and How to Buy

A single user license allows one user on one computer and is $5,500, an enterprise license allowing an unlimited number of users at a company is $15,000. The model may be purchased at a discount on-line with a credit card here or you may email or fax us a purchase order with 30 day terms. The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.


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Cost Model Support Policy - updated 6/5/2019


Strategic Cost and Price Model User Manual - updated 8/16/2019


Strategic Cost and Price Model Quick Start Guide - posted 12/1/2018


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